詹宗晟 (Tsung-Cheng Chan)
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Office
Phone Address |
306, M. S. Lab. Building
(886)3-5715131 ext 33860 [email protected] Material Science and Engineering National Tsing Hua University Room 306, M. S. Lab. Building,101, Sec. 2, Kuang-Fu Road, Hsinchu, Taiwan 300, R. O. C. |
Biosketch
- Ph.D., Materials Science and Engineering, National Tsing Hua University, 2008-present
- M.S., Materials Science and Engineering, National Tsing Hua University, 2006-2008
- B.S., Materials Science and Engineering, National Tsing Hua University, 2002-2006
Publications
- T. C. Chan, Y. L. Chueh, and C. N. Liao “Manipulating crystallographic texture of nanotwinned Cu films by electrodeposition”, Crystal Growth & Design, (under review)
- Ching-Chun Lin, Wei-Fan Lee, Ming-Yen Lu, Szu-Ying Chen, Min-Hsiu Hung, Tsung-Cheng Chan, Yu-Lun Chueh and Lih-Juann Chen “Low temperature synthesis of Copper Telluride Nanostructures: Manipulation of Growth, electrical properties, and Phase Formation”, Nano Lett.
Patents
- T. C. Chan, Y. L. Chueh, and C. N. Liao “A METHOD FOR FABRICATION HIGH DENSITY NANOTWINED STRUCTURE CU THIN FILMS”, R.O.C. and U.S.A. Patent. (preparation)
- Y. M. Lin, T. C. Chan, Y. L. Chueh, and C. N. Liao “A METHOD FOR FABRICATION HIGH DENSITY NANOTWINED COPPER NANOWIRES”, R.O.C. and U.S.A. Patent. (preparation)
Awards & Honors
- Ministry of Education Scholarship for MSE Ph.D. program. 2008